PCB

PCB Fabrication

We provide a one-stop PCB solution, from prototypes to high-volume production.

Our expertise includes ELIC, HDI, VIPPO, Back Drilling, and other specialty PCB technologies, ensuring precision and reliability at every stage. Manufacturing is located in Korea.

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ATE/Burn-In Boards

Be it stacked up RF high frequency or burn-in, low or high volume, the boards are delivered on time. Managed by a local US project team to ensure your boards are done right and quickly.

Capabilities
Layers 2 - 80L
Board Size 15.75" x 30.0"
Board Thickness 0.093" - 0.250"
DUT/Drill Pattern Pitch 0.0118" (0.3mm) min
Line Width 2.5 mil
Line Space 2.5 mil
Mechanical Drill 4 mil | 10 mil
Laser Drill 3 mil | 6 mil
Inner Laywer Spacing Pad/Trace 1.5 mil
Aspect Ratio Mechanical 42:1
Stub Drilling Max Depth 0.30 (0.3mm) - 0.130 (0.5mm)
Stub Drill Diameter 0.0079 (0.3mm) - 0.01 (0.5mm)
Surface Finish ENIG | ENIPIG | Hard Au | Selective Au | Flash Au
Impedance 50 Ohm Standard +-10% | Advance +-5%

Materials
Standard FR-4 High-Tg, High-Td
Low Dk/Df for High Speed/Frequency Megtron, Rogers

Probe Card, Load, Hi-Fix Boards

Our manufacturing partners in Korea are experts in a wide variety of boards. Contact us to discuss your project needs for a quick turnaround delivery with highest quality in the industry.

Capabilities
Layers 100L
Board Size 24.0" x 28.3"
Board Thickness 0.189" - 0.330"
BGA Pitch 0.008"
Pattern Width Inner | Outer 0.0016" | 00024"
Line Space 2.5 mil
Mechanical Drill 4 mil | 10 mil
Laser Drill 3 mil | 6 mil
Inner Laywer Spacing Pad/Trace 1.5 mil
Aspect Ratio 42:1
Stub Drilling Max Depth 0.30 (0.3mm) - 0.130 (0.5mm)
Stub Drill Diameter 0.0079 (0.3mm) - 0.01 (0.5mm)
Surface Finish ENIG | ENIPIG | Hard Au | Selective Au | Flash Au
Impedance 50 Ohm Standard +-10% | Advance +-5%

Materials
Standard FR-4 High-Tg, High-Td, Nelco, Other
Low Dk/Df for High Speed/Frequency Megtron, Rogers, Other

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