PCB
PCB Fabrication
We provide a one-stop PCB solution, from prototypes to high-volume production.
Our expertise includes ELIC, HDI, VIPPO, Back Drilling, and other specialty PCB technologies, ensuring precision and reliability at every stage. Manufacturing is located in Korea.
ATE/Burn-In Boards
Be it stacked up RF high frequency or burn-in, low or high volume, the boards are delivered on time. Managed by a local US project team to ensure your boards are done right and quickly.
Layers | 2 - 80L |
Board Size | 15.75" x 30.0" |
Board Thickness | 0.093" - 0.250" |
DUT/Drill Pattern Pitch | 0.0118" (0.3mm) min |
Line Width | 2.5 mil |
Line Space | 2.5 mil |
Mechanical Drill | 4 mil | 10 mil |
Laser Drill | 3 mil | 6 mil |
Inner Laywer Spacing Pad/Trace | 1.5 mil |
Aspect Ratio Mechanical | 42:1 |
Stub Drilling Max Depth | 0.30 (0.3mm) - 0.130 (0.5mm) |
Stub Drill Diameter | 0.0079 (0.3mm) - 0.01 (0.5mm) |
Surface Finish | ENIG | ENIPIG | Hard Au | Selective Au | Flash Au |
Impedance | 50 Ohm Standard +-10% | Advance +-5% |
Standard FR-4 | High-Tg, High-Td |
Low Dk/Df for High Speed/Frequency | Megtron, Rogers |
Probe Card, Load, Hi-Fix Boards
Our manufacturing partners in Korea are experts in a wide variety of boards. Contact us to discuss your project needs for a quick turnaround delivery with highest quality in the industry.
Layers | 100L |
Board Size | 24.0" x 28.3" |
Board Thickness | 0.189" - 0.330" |
BGA Pitch | 0.008" |
Pattern Width Inner | Outer | 0.0016" | 00024" |
Line Space | 2.5 mil |
Mechanical Drill | 4 mil | 10 mil |
Laser Drill | 3 mil | 6 mil |
Inner Laywer Spacing Pad/Trace | 1.5 mil |
Aspect Ratio | 42:1 |
Stub Drilling Max Depth | 0.30 (0.3mm) - 0.130 (0.5mm) |
Stub Drill Diameter | 0.0079 (0.3mm) - 0.01 (0.5mm) |
Surface Finish | ENIG | ENIPIG | Hard Au | Selective Au | Flash Au |
Impedance | 50 Ohm Standard +-10% | Advance +-5% |
Standard FR-4 | High-Tg, High-Td, Nelco, Other |
Low Dk/Df for High Speed/Frequency | Megtron, Rogers, Other |
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